Building a safe and secure embedded world

Boards and modules: by form factor

We have grouped the boards and modules into their form factors based on industrial standards such as PC/104, ETX , Q7, COMExpress and SMARC etc.

These are industrial standards that multiple vendors can adhere to and therefore give you the best choice should you want to dual source. These cover x86 and ARM but if you are looking for a particular processor please explore our other boards and modules sections where there are a growing number of proprietary formats, expanding your choice even further.

Again if you cannot find what you are looking for then please contact us.

Please click on the logos below to be taken to the relevant form factor for your requirements.

ETX form factor

ETX-BT with Intel® Atom™ Processor

  • Intel® Atom™ E3800 Series SoC & Celeron N2930/J1900 Processor
  • 4 GB non-ECC DDR3L at 1333 MHz
  • Dual channel 24-bit LVDS & VGA
  • 2x SATA & 2x PATA (M/S), 4x USB 2.0, 10/100 Mbps LAN (GbE via onboard connector)
  • Extreme Rugged operating temperature: -40° to +85°
  • Supports Smart Embedded Management Agent (SEMA)

The ETX-BT is based on the latest Intel® Atom™ processor E3800 SoC series, adopting the latest 22nm process technology with 3-D Tri-Gate transistors featuring significant improvements in computational performance and energy efficiency. The E3800 SOC series integrates processor and GPU cores and all I/O on a single chip. Processor performance is scalable from a single-core Intel® Atom™ processor E3815 at 1.4GHz to a quad-core Intel® Atom™ processor E3845 at 1.9GHz. Two quad-core Intel® Celeron® processors, based on the same microarchitecture, are also available.

Q-Seven form factor

Q7-BW with Intel® Pentium™ and Celeron™ Processor

Q7-BT with 4th Generation Intel® Atom™ Processor

  • Intel® Pentium™ & Celeron™ Processor N3000 Series SoC
  • 2x 64bit memory channel with up to 8GB DDR3L at 1600 MHz
  • Dual channel LVDS, HDMI/DP
  • 2x MIPI CSI camera interface, 3x PCIe, GbE
  • 2x SATA3 or 1x SATA and 1x SATA-SSD
  • 1x USB 3.0 host, 6x USB 2.0 host, SPI, I2C, HDA, UART, LPC, SMBus

Qseven is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET. The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor. The Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for PCI Express graphics cards in notebooks.

  • Single, dual or quad core 4th Generation Intel® Atom™ Processor E3800 Series System-on-Chip
  • Up to 4 GB DDR3L at 1066/1333 MHz
  • HDMI 1.4b and dual channel LVDS
  • GbE, MIPI CSI camera interface
  • 2x SATA 3Gb/s or 1x SATA and 1x SATA-SSD
  • Extreme Rugged™ -40°C to +85°C
  • Supports Smart Embedded Management Agent (SEMA)

Qseven is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET. The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor.

SMARC form factor

LEC-BT with Intel® Atom™ Processor E3800 Series

LEC-BW with Intel® Pentium™ and Celeron™ Processor

LEC-BTS with Intel® Atom™ Processor E3800 Series

  • Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip
  • Up to 8 GB DDR3L at 1066/1333 MHz (ECC)
  • HDMI and LVDS, onboard eMMC
  • GbE, camera interface
  • 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO
  • Extreme Rugged™ operating temperature: -40°C to 85°C

The ADLINK LEC-BT computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BT is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

  • Dual or quad-core Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
  • Up to 8 GB DDR3L at 1333/1600 MT/s
  • Single channel LVDS, HDMI/DP
  • 2x MIPI CSI camera interfaces, GbE, 3x PCIe
  • 1x SDIO, 2x SATA3, 1x USB 3.0 host, 4x USB 2.0 host, 12x GPIO, 2x SPI, 4x I2C, 1x eMMC

The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. The Modules are used as building blocks for portable and stationary embedded systems.

  • Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip
  • Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)
  • HDMI and LVDS
  • GbE, camera interface
  • 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO
  • Extreme Rugged™ operating temperature: -40°C to +85°C

The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.

LEC-iMX6

  • Freescale SoC i.MX6 ARM Cortex A9 processor
  • Integrated 2D/3D graphics processors, 3D 1080p video processing
  • Scalable memory: 512 MB to 2 GB
  • Up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s
  • Extended temperature: -40°C to +85°C

The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.

COMexpress Type 7 form factor

Express-BD7 with up to 16 cores Intel® Xeon D and Pentium® D

  • Up to 16 cores Intel® Xeon D Series SoC
  • Up to 32GB dual channel DDR4 at 1867/2133/2400MHz ECC
  • Two 10G Ethernet and NC-SI support
  • Up to eight PCIe x1 (Gen2), one PCIe x16 (Gen3)
  • GbE, two SATA 6 Gb/s, four USB 3.0/2.0
  • Supports Smart Embedded Management Agent (SEMA®)
  • Extreme Rugged operating temperature: -40°C to +85°C

The Express-BD7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel® Xeon® processor D and Intel® Pentium® D processor system-on-chip (SoC) ( formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.

COMexpress Type 6 form factor

cExpress-SL with 6th Gen Intel Core i7/i5/i3 and Celeron 3955U

TQMx60EB with Intel® Core™ i3/i5/i7 6000E (Generation 6)

Express-BL with 5th Gen Intel Core and Xeon Processors

  • Up to 32GB non-ECC Dual channel DDR4 at 2133/1867 MHz
  • Two DDI channels, one LVDS or 4 lanes eDP, support up to 3 displays
  • Up to 6 PCIe x1
  • GbE, up to 3x SATA 6 Gb/s, 4x USB 3.0 & 4x USB 2.0
  • Supports Smart Embedded Management Agent (SEMA)
  • Extreme Rugged operating temperature: -40°C to +85°C

The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly "Skylake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron™ System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel's Configurable TDP in a long product life solution.

  • High end performance up to Quad-Core 3.7 GHz / 8 MB cache
  • Impressive graphics performance
  • Best in class power optimization
  • Up to 32 GB Dual-Channel DDR4 (2 SO-DIMMs), ECC
  • High bandwidth with up to 24 PCIe Gen. 3 lanes (incl. PCIe x16 PEG port)
  • Highest reliability, 24/7 certified

With Dual-Channel DDR4-2133 support, high bandwidth PCIe, 4x SATA (6 Gb/s) and 4x USB 3.0 the TQMx60EB guarantees best in class system performance. The module can be equipped with 6th Generation Intel® Core™ i7/i5/i3 and Intel® Xeon® E3-15xx v5 processors (Codename Skylake-H). The integrated Intel® GT1/GT2/GT4e graphics controller supports up to three independent display outputs with up to 4K resolution @ 60 Hz and excellent 3D / rendering performance. Latest power and performance optimizing functions like Intel® Turbo Boost Technology 2.0 and Enhanced Intel® SpeedStep Technology enable perfect user experience with moderate power consumption.

  • 5th Gen Intel Core and Xeon Processors (codename: Broadwell)
  • Up to 32GB dual channel DDR3L at 1600 MHz
  • 3x DDI channels, one LVDS and VGA, support up to 3 independent displays
  • Seven PCIe x1 and one PCIe x16
  • GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature:-40°C to +85°C

The Express-BL is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 5th Generation Intel® Core™ i7 and Xeon® E3-1200L v4 processors (codename "Broadwell") with Intel® QM87 Chipset. The Express-BL is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.

Express-BE with AMD® Embedded R-Series APU

Express-HL with 4th Gen Intel Core or Celeron Processors

cExpress-HL with 4th Gen Intel® Core™ i7/i5/i3 Processors

  • AMD® Embedded R-Series APU with A77E Fusion Controller Hub
  • Up to 16GB Dual Channel DDR3L at 1600/1333 MHz
  • Three DDI ports and one LVDS port supporting 4 independent displays
  • Seven PCIe x1, one PCIe x16
  • GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA®) functions

The Express-BE is a COM Express® COM.0 R2.1 Type 6 module supporting AMD R-Series APU (codename : Bald Eagle) with A77E Fusion Controller Hub. The Express-BE is specifically designed for customers who need excellent graphics performance and high-level processing performance with low power consumption in a long product life solution. The Express-BE features AMD Bald Eagle APU supporting Heterogeneous System Architecture (HSA) and non-ECC type DDR3L dual-channel memory at 1333/1600 MHz to provide excellent overall performance.

  • 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset and Celeron Processors (Mobile) with Mobile Intel HM86 Express Chipset
  • Up to 16GB Dual Channel DDR3L SDRAM at 1600MHz
  • Three DDI channels supporting 3 independent displays
  • Seven PCIe x1, one PCIe x16
  • GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA®) functions

The Express-HL is a COM Express® COM.0 R2.1 Type 6 module supporting the 64-bit 4th Generation Intel® Core™ i7/i5/3 or Celeron processor with CPU (formerly codenamed Haswell), memory controller, and graphics processor on the same chip. Based on the latest Mobile Intel® QM87 or HM86 Express chipset, the ExpressHL is specifically designed for customers who need high-level processing and graphics performance in a long product life solution.

  • 4th Generation Intel® Core™ i7/i5/i3 Processor SoC
  • Up to 16 GB DDR3L SDRAM at 1600MHz
  • Two DDI channels, one LVDS supporting 3 independent displays
  • Four PCIe x1 or 1 PCIe x4, Gigabit Ethernet
  • Four SATA 6 Gb/s, two USB 3.0, six USB 2.0
  • Supports Smart Embedded Management Agent (SEMA®) functions

The cExpress-HL is a COM Express® COM.0 R2.1 Type 6 Compact size module supporting the 64-bit 4th Generation Intel® Core™ i7/i5/3 ULT Processors with CPU (codename: Haswell), memory controller, graphics processor and I/O hub on the same chip. Leveraging the benefits provided by the Intel® Core™ i7/i5/3 ULT System-on-Chip, the cExpress-HL is specifically designed for customers who need optimum processing and graphics performance with low power consumption in a long product life solution.

Express-HLE with 4th Gen Intel Core i7/i5/i3 Processor with ECC

Express-IB with 3rd Generation Intel® Core™ i7/i5/i3 Processor

Express-IBR with 3rd Gen Intel Core Processor & QM77 Chipset

  • 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset
  • Dual channel 1600/1333 MHz DDR3L up to 16GB with ECC support in dual SODIMM sockets
  • Three DDI ports support 3 independent displays
  • Seven PCIe x1, one PCIe x16
  • GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA®) functions

The Express-HLE is a COM Express COM.0 R2.1 Type 6 module supporting the 64-bit 4th Generation Intel Core i7/i5/3 processor with CPU (formerly codenamed Haswell), memory controller, and graphics processor on the same chip. Based on the latest Mobile Intel QM87 Express chipset, the Express-HLE is specifically designed for customers who need high-level processing and graphics performance in a long product life solution.

  • Quad/dual core 3rd Generation Intel® Core™ i7/i5/i3 Processor with Mobile Intel® QM77 Express Chipset
  • Up to 16GB Dual Channel DDR3 SDRAM at 1600MHz
  • Three Digital Display Interfaces (DDI) for DisplayPort /HDMI/DVI/SDVO
  • Seven PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1)
  • Two SATA 3 Gb/s, two SATA 6 Gb/s, Gigabit Ethernet, four USB 3.0, four USB 2.0

The Express-IB is a high performance COM.0 R2.0 Type 6 module featuring an Intel® Core™ i7/i5/i3 processor supporting Intel® HD Graphics integrated on the CPU with three independent displays. A PCI Express x16 Generation 3.0 bus is available for discrete graphics expansion or general purpose PCIe (optionally configure as 2 x8 or 1 x8 + 2 x4).

  • Quad/dual core 3rd Generation Intel® Core™ Processor with Mobile Intel® QM77 Express Chipset
  • Up to 16GB 1600MHz DDR3 with ECC support in two SODIMM sockets
  • Three Digital Display Interfaces (DDI) for DisplayPort /HDMI/DVI/SDVO
  • Seven PCIe x1 (Gen 2), one PCIe x16 (Gen 3) for graphics (or general purpose x8/4/1)
  • Two SATA 6 Gb/s, two SATA 3 Gb/s, Gigabit Ethernet, USB 2.0, 4 USB 3.0
  • 50% Thicker PCB for high vibration environments

ADLINK™ Express-IBR is a COM Express® Type 6 module with quad/dual-core 3rd Generation Intel® Core™ i7/i5/i3 Processor. The Express-IBR is designed Extreme Rugged™ to support the extremes of shock, vibration, humidity, and temperature.

Express-HR with 2nd Gen Intel Core i7/i5/i3 & Intel QM67

Express-HRR with Intel® Core™ i7 processor and QM67 Chipset

cExpress-BT with Intel® Atom™ or Intel® Celeron® Processor SoC

  • Intel® AtomTM E3800 ("Bay Trail-I")
  • Up to 8 GB DDR3L with ECC support, soldered
  • Optimized for ultra low power
  • Extended temperature support 
  • Reach featured uEFI BIOS with easy-config, multi-setup and touch-support
  • TQMx86 board-controller with customer specific expandability (flexiCFG)
  • USB 3.0 device interface; TPM 1.2 / 2.0
  • iRTC (highly accurate Industrial Real-Time-Clock)
  • Highest reliability, 24/7 certified
  • Extra robust design; formal coating capability

The TQ mini module TQMxE38C enables the implementation of powerful but also economical x86 based systems based on the international established PICMGTM standard COM ExpressTM Mini (COM.0 R2.1). At the type 6 compliant pin out the user has access to all fundamental interfaces of the CPU. For that all capabilities of the Intel® AtomTM processor could be used. 

  • Quad/dual core Intel® Core™ i7 Processor
  • Intel® QM67 Chipset
  • Up to 16GB ECC 1333Mhz DDR3 memory in two SODIMM sockets
  • Three Digital Display Interfaces (DDI) for DisplayPort /HDMI/DVI/SDVO
  • Seven PCIe x1, one PCIe x16 (Gen2) for graphics (or general purpose x8/4/1)
  • Two SATA 6 Gb/s, two SATA 3 Gb/s, Gigabit Ethernet, eight USB 2.0
  • Extended Temperature: -40°C to +85°C
  • 50% Thicker PCB for high vibration environments

ADLINK™ Express-HRR is a COM Express® Type 6 module with quad/dual-core 2nd Generation Intel® Core™ i7 Processor. The Express-HRR is designed Extreme Rugged to support the extremes of shock, vibration, humidity, and temperature.

  • Single, dual, quad-core Intel® Atom™ or Celeron® Processor System-on-Chip (SOC)
  • Up to 8GB Dual Channel DDR3L at 1333MHz
  • VGA and two DDI channels (optional LVDS)
  • Three PCIe x1, GbE
  • Two SATA 3Gb/s, one USB 3.0, seven USB 2.0
  • Supports Smart Embedded Management Agent (SEMA®) functions

The cExpress-BT is a COM Express® COM.0 R2.1 Type 6 module supporting the Intel® Atom™ processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.

TQMxE38C - with Intel® Atom™ E3800

  • Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip
  • Up to 8 GB DDR3L at 1066/1333 MHz (ECC)
  • HDMI and LVDS, onboard eMMC
  • GbE, camera interface
  • 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO
  • Extreme Rugged™ operating temperature: -40°C to 85°C

The ADLINK LEC-BT computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BT is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

COMexpress Type 10

nanoX-TCR Extreme Rugged with Intel® Atom™ Processor

nanoX-BT with Intel Atom E3800 series SoC or Celeron Processors

TQMxE38M with Intel® Atom™ E3800

  • Intel® Atom™ Processor E6xx from 600 MHz up to 1.6 GHz
  • 1-2 GB soldered industrial grade 800MHz DDR2 SDRAM
  • 24-bit LVDS and SDVO support
  • PCI Express x1 lanes
  • Intel® Platform Controller Hub EG20T for USB, LAN, SDIO, Serial & CAN bus and SATA
  • Optional Solid State Drive up to 16 GB
  • COM Express® COM.0 R2.1 Type 10 Pinout

ADLINK™ nanoX-TCR is a COM Express® Nano Type 10 module with the Intel® Atom™ Processor E6xxT. The nanoX-TCR is designed Extreme Rugged™ for wide temperature range and high vibration environments.

  • Single, dual, quad-core Intel Atom or Celeron Processor System-on-Chip
  • Up to 4GB soldered Dual Channel DDR3L at 1333MHz
  • One DDI channel, one LVDS (optional eDP)
  • Three PCIe x1, GbE
  • Two SATA 3Gb/s, four USB and one USB client
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40C to +85C (optional)
  • Starter kit for development: nanoX-BT starter kit Plus; Carrier Board: MiniBASE-10R

The nanoX-BT is a COM Express COM.0 R2.1 Type 10 module supporting Intel Atom processor E3800 Series and Intel Celeron N2930/J1900 processor SoC (codename: Bay Trail). The nanoX-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.

  • Intel® AtomTM E3800 ("Bay Trail-I")
  • Up to 8 GB DDR3L with ECC support, soldered
  • Optimized for ultra low power
  • Extended temperature support 
  • Reach featured uEFI BIOS with easy-config, multi-setup and touch-support
  • TQMx86 board-controller with customer specific expandability (flexiCFG)
  • USB 3.0 device interface; TPM 1.2 / 2.0
  • iRTC (highly accurate Industrial Real-Time-Clock)
  • Highest reliability, 24/7 certified
  • Extra robust Design; formal coating capability

The TQ mini module TQMxE38M enables the implementation of powerful but also economical x86 based systems based on the international established PICMGTM standard COM ExpressTM Mini (COM.0 R2.1). At the type 10 compliant pin out the user has access to all fundamental interfaces of the CPU. For that all capabilities of the Intel® AtomTM processor could be used.

nanoX-TC with Intel® Atom™ Processor

  • Intel® Atom™ Processor E6xx from 600 MHz up to 1.6 GHz
  • Up to 2 GB soldered DDR2 SDRAM at 800 MHz
  • 24-bit LVDS and SDVO support
  • 4x PCI Express x1 lanes
  • Optional Intel® Platform Controller Hub EG20T for USB, LAN, SDIO, Serial & CAN bus and SATA

No bigger in size than a business card, the nanoX-TC is a COM Express™ Mini form factor Type 10 pinout compatible computer-on-module that targets battery powered, mobile and handheld system designs. The new Mini size form factor with a footprint of just 55 mm x 84 mm is the smallest size in ADLINK's COM Express product lineup, next to the Basic size (125 mm x 95 mm) and Compact size (95x95) form factors.

COMexpress Type 2

Express-IBE2 with Intel® Core™ i7/i5/i3 Processor

Express-CB with Intel® Core i7/i5/i3 Processor

Express-CBR Extreme Rugged with Intel® Core™ i7 Processor

  • Quad/dual-core Intel® Core™ i7/i5/i3 Processor with Mobile Intel® QM77 Express Chipset
  • Up to 16GB Dual Channel DDR3 SDRAM at 1600MHz with ECC memory
  • Single/dual channel 18/24-bit LVDS and SDVO
  • Five PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1)
  • Four SATA, one PATA IDE, GbE and eight USB 2.0
  • Supports Smart Embedded Management Agent (SEMA®)

The Module Computing Product Segment (MCPS) is pleased to introduce its latest COM Express® Type 2 Module with Intel® Core™ i7/i5/i3 Processor and QM77 Chipset, the Express-IBE2. The Express-IBE2 is a COM Express® COM.0 R2.1 Type 2 module with a 3rd Generation Intel® Core™ i7/i5/3 processor and support for error-correcting code (ECC) memory.

  • Intel® Core™ i7/i5/i3 Processor with Mobile Intel® QM57 Express Chipset
  • Up to 8 GB Dual Channel DDR3 SDRAM at 1066 MHz (optional ECC)
  • Six PCIe x1, one PCIe x16 for graphics (or general purpose x8/4/1)
  • 18/24-bit LVDS and Embedded DisplayPort
  • SATA 3 Gb/s IDE (PATA), Gigabit LAN, USB 2.0

The Express-CB is a COM Express™ Type 2 module supporting the 64-bit IntelR Core™ i7 / i5 / i3 processor with CPU, memory controller, and graphics processor on the same chip. Based on the latest Mobile IntelR QM57 Express chipset, the Express-CB is specifically designed for customers who need high-level processing and graphics performance in a long product life solution. Integrated graphics support includes features such as OpenGL 2.1, DirectX10, and IntelR Dynamic Video Memory Technology (IntelR DVMT 5.0). Graphics outputs include CRT, LVDS and Embedded DisplayPort. The Express-CB is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

  • Intel® Core™ i7 Processor with Mobile Intel® QM57 Express Chipset
  • Dual Channel DDR3 SODIMM up to 8GB
  • Onboard Gigabit Ethernet
  • Embedded DisplayPort (eDP) or PCI Express x8
  • Dual Channel 18/24-bit LVDS, VGA and SDVO

The Express-CBR leverages the Intel® Core™ i7 processor for ultra high performance and the Intel® 82574IT GbE Controller for a wide range of temperature applications. USB 2.0, SATA and PICMG® COM Express™ COM.0 compliance. Also featured are Intel® Turbo Boost, Hyper-Threading Technology, USB 2.0, SATA and PICMG® COM Express™ COM.0 compliance.

Express-HL2 with 4th Gen Intel® Core™ i7/i5/i3 Processor

  • 4th Gen Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express
  • Up to 16GB Dual Channel DDR3L at 1600MHz
  • Dual Channel LVDS and VGA supporting 2 independent displays
  • Six PCIe x1, one PCIe x16 and 32-bit PCI-bus
  • GbE, four SATA 6 Gb/s, one PATA,IDE, eight USB 2.0
  • Supports Smart Embedded Management Agent (SEMA®)

ADLINK"s Express-HL and Express-HL2 COM Express modules with 4th generation Intel® i7/i5 processor (codename: Haswell) - up to 3.1GHZ quad core - and mobile Intel® QM87 Express chipset offer up to 16GB dual channel DDR3L SDRAM at 1600MHz. The Express-HL is a COM Express Type 6 module offering three independent displays via DDI interface, as well as seven PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1), four SATA III (6 Gb/s), Gigabit Ethernet, four USB 2.0, and four USB 3.0 interfaces. The Express-HL2 features the COM Express Type 2 pinout and offers 18/24-bit single/dual channel LVDS, Analog CRT, and a legacy 32 bit PCI bus, as well as PATA IDE interface.

PC/104 form factor

CM1-BT1 Extreme Rugged™ PC/104 SBC with Intel® Atom™

CM1-86DX3 PC/104 SBC with Vortex86DX3 SoC

CM1-86DX2 PC/104 SBC with Vortex86DX2 SoC

  • Single/Dual-core Intel® Atom™ Processor System-on-Chip
  • Up to 4GB DDR3L at 1333MHz
  • Supports VGA and LVDS
  • GbE (optional 2x GbE)
  • 1x SATA 3Gb/s (optional 2x SATA), 3x USB 2.0, 8x GPIO
  • Extreme Rugged™ operating temperature range: -40°C to +85°C
  • Supports Smart Embedded Management Agent (SEMA)

The ADLINK CM1-BT1 with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. CM1-BT1 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

  • Ultra low power, DM&P Vortex86DX3 SoC
  • Full ISA bus support
  • 2GB soldered DDR3L
  • 1x GbE, 1x Fast Ethernet
  • SATA, CFast
  • VGA and 18/24-bit single channel TTL/TFT
  • Supports Smart Embedded Management Agent (SEMA)

The CoreModule CM1-86DX3 is a PC/104 board with DMP Vortex86-DX3 single chip solution and has a very good performance to power ratio. The board comprises all peripherals needed for an embedded PC on a small 3.775" by 4.050" printed circuit board. The CoreMoCM1-86DX3 integrates a powerful yet efficient DMP Vortex86DX3 with graphic controller and audio controller together with an additional GBit Ethernet controller to form a complete PC, with all the standard peripherals already onboard.

  • Single, dual or quad-core Intel® Atom™ or Celeron® Processors
  • Up to 4GB DDR3L at 1333MHz
  • Supports VGA and LVDS
  • GbE, 1x SATA 3Gb/s
  • 3x USB 2.0, 8x GPIO
  • Extreme Rugged™ operating temperature: -40°C +85°C
  • Supports Smart Embedded Management Agent (SEMA)

The CoreModule CM1-86DX2 is a PC/104 board with DMP Vortex86-DX2 single chip solution and has a very good performance to power ratio. The board comprises all peripherals needed for an embedded PC on a small 3.775" by 4.050" printed circuit board. The CoreMoCM1-86DX2 integrates a powerful yet efficient DMP Vortex86DX2 with graphic controller and audio controller together with an additional GBit Ethernet controller to form a complete PC, with all the standard peripherals already onboard.

CoreModule 430 - 486 PC/104 SBC highly integrated, low power

  • -40°C to +85°C
  • 10/100 Ethernet, 3D Video
  • 4 Serial, 2 USB, 8 GPIOs
  • PC/104 Expansion
  • Ultra Low Power
  • 486 migration

Based on the Vortex86SX 300MHz or Vortex86DX 800MHz processor, ADLINK™ CoreModule® 430 provides 4 serial ports (two with RS-422/485 capability), 10/100BASE-T Ethernet, CRT and flat panel video, 2 USB, IDE, floppy and GPIO support in a PC/104 form factor.

PC/104-plus form factor

CM2-BT2 Extreme Rugged™ PC/104-Plus SBC

  • Dual-core Intel® Atom™ Processor System-on-Chip
  • Up to 4GB DDR3L at 1333MHz
  • Supports VGA and LVDS
  • GbE (optional 2x GbE)
  • 1x SATA 3Gb/s (optional 2x SATA), 3x USB 2.0, 8x GPIO
  • Extreme Rugged™ operating temperature: -40°C to +85°C
  • Supports Smart Embedded Management Agent (SEMA)

The ADLINK CM2-BT2 with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. CM2-BT2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

PCI/104 form factor

CM3-BT1 Extreme Rugged™, PCI-104 SBC

CM3-BT4 Extreme Rugged™ PC/104-Plus, PCI-104 SBC

  • Easiest migration of PowerQUICC III on QorIQ™ by approved e500v2 core
  • Single (P1011/P1012)- and MultiCores (P1020/P1021) of 400 up to 2x 800 MHz in 45nm SOI for best Performance/Watt ratio
  • High-Speed communication via 3x Gigabit Ethernet, 2x PCIe and one USB 2.0 interface
  • Simple function extension via PCIe, SPI, I²C and flexible local bus

The ADLINK CM3-BT1 with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. CM3-BT1 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

  • Quad-core Intel® Atom™ Processor System-on-Chip
  • Up to 4GB DDR3L at 1333MHz
  • Supports VGA and LVDS
  • GbE (optional 2x GbE)
  • 1x SATA 3Gb/s (optional 2x SATA), 3x USB 2.0, 8x GPIO
  • Extreme Rugged operating temperature: -40°C to +85°C
  • Supports Smart Embedded Management Agent (SEMA)

The ADLINK CM3-BT4 with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. CM3-BT4 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

PCI/104Express form factor

CoreModule 920 Extreme Rugged™ PCI/104-Express SBC

  • Dual-core 3rd Generation Intel® Core™ Processor
  • Up to 4GB industrial grade solder down ECC 1600MHz DDR3 memory
  • One HDMI, one VGA, and one 18/24-bit LVDS display interfaces
  • 8GB industrial grade Solid State Disk
  • One PCIe x16 (Gen 3) and 1 x4 or 4 x1 (Gen 2)
  • Two SATA 6 Gb/s ports, two Gigabit Ethernet, four USB 2.0 interfaces, and two serial ports
  • PCI/104-Express Type 1 and PCI/104 expansion interfaces
  • Extreme Rugged™ operating temperature: -40°C to +85°C

The ADLINK™ CoreModule® 920 is a PCI/104-Express SBC (Type 1) based on the 3rd generation Intel® Core™ i7?3517UE processor and provides the highest level of performance for our PC/104 product family. The PCI/104-Express stackable form factor supports both PCIe and PCI bus connectivity and allows customers to build low power solutions for space constrained, extreme rugged environments.

EPIC form factor

ReadyBoard 910 EPIC SBC with Intel® Core™ Processor

  • 2nd/3rd Generation Intel® Core™ i7/i5/i3 Processor
  • Dual Gigabit Ethernet
  • USB 3.0 with SuperSpeed 5Gb/s Data Transfer Rate
  • Analog VGA, LVDS and DVI-D display
  • PCI Express Mini Card socket; PCI-104 expansion
  • Onboard SSD

The ReadyBoard 910 is a mid-sized, EPIC-compatible, high quality single-board system, which contains all the component subsystems of a PC/AT PCI motherboard plus the equivalent of up to 4 PCI expansion boards. The ReadyBoard 910 is based on the high-performance, high-integration, Intel® Core™ i5 and i7 CPUs, which incorporate multi cores with integrated Northbridge Graphics and Memory Hubs (GMHs), providing high-performance processor cores, memory controllers for up to 16GB of standard DDR3 SODIMM memory, and graphics controllers for VGA, LVDS, and DVI signals driven by the chipset. One of these processors combined with the matching chipset provide the designer a complete integration solution based on the EPIC form factor and Revision 2.0 of the EPIC standard.

Mini-ITX form factor

AmITX-SL-G Mini-ITX with 6th Gen Intel Core

AmITX-BW-I Thin Design Mini-ITX with Intel Processors

AmITX-BT-I Mini-ITX Embedded Board with Intel®

  • 6th Gen Intel Core i7/i5/i3, Intel Pentium G4400/G4400TE and Celeron G3900/G3900TE Desktop Processor with Intel® Q170/H110 Chipsets
  • Up to 32 GB dual channel DDR4 at 2133 MHz
  • Intel Gen 9 graphics, 3x DP, LVDS co-lay with eDP (opt.)
  • 1x PCIe x16 (Gen 3), 1x PCIe x1 (Gen 2), 1x full size Mini PCIe + USB or mSATA, 1x half size Mini PCIe + USB, 1x SPI header for external BIOS
  • Q170: 7x USB 3.0, 4x USB 2.0; H110: 4x USB 3.0, 7x USB 2.0

The AmITX-SL-G is a Mini-ITX motherboard supporting the Desktop 6th Generation Intel® Core™ i7/i5/i3 and Pentium® and Celeron® Processor with Intel® Q170/H110 Chipset. The AmITX-SL-G is specifically designed for customers who need high-level processing and graphics performance with a long product life solution.

  • Intel Atom X5 E8000, Pentium N3710 and Celeron N3160/N3060/N3710 Processors (codename: Braswell)
  • 1x HDMI, 2x DP, LVDS and eDP (opt.)
  • Up to 8 GB non-ECC dual channel DDRL3 at 1600/1333 MHz
  • 3 independent high resolution graphic displays
  • 2x GbE
  • 4x USB 3.0 (Rear IO), 2x USB 2.0 (Header), 2x USB 2.0 (Front panel)
  • 1x PCIe x16, 1x Mini PCIe, 1x mSATA, 1x SPI header for external BIOS

The AmITX-BW-I is a low-profile Thin Mini-ITX embedded board supporting an Intel® Pentium®/Celeron® processor N3000 family and Intel Atom™ processor x5-E8000 system-on-chip (SoC). The AmITX-BW-I is specifically designed for customers who need significant graphics performancewith low power consumption in a long product life solution. The Intel® Pentium®/Celeron® processor N3000 family and Intel Atom™ processor x5-E8000 SoC (formerly "Braswell") are built on 14nm technology and support non-ECC type DDR3L dual-channel memory at 1600/1333 MHz to provide excellent overall performance.

  • Intel® Atom™ Processor E3800 Series SoC and Intel Celeron N2930/J1900 Processors
  • Up to 8 GB dual channel DDR3L 1333/1066 MHz
  • VGA, 24-bit dual channel LVDS and HDMI OpenGL 3.0
  • Extreme Rugged Operating Temperature: -40°C to +85°C (opt., Atom™ E38xx series only)

The AmITX-BT-I is a Mini-ITX Embedded Boards supporting the Intel® Atom™ processor E3800 Series and Intel® Celeron® processor system-on-chip (SoC). The AmITX-BT-I is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.

AmITX-HL-G Mini-ITX Embedded Board with 4th Gen Intel Core

AmITX-BE-G Mini-ITX Embedded Board with AMD Embedded

AmITX-IB-I Mini-ITX Embedded Board with Intel Xeon

  • 4th Gen Intel Core i7/i5/i3, Pentium and Celeron Desktop Processor with Intel® Q87/H81 Chipset (codename: Haswell/Haswell Refresh)
  • 1x PCIe x16, 1x PCIe x1 and Mini PCIe expansions
  • 3 DisplayPorts and LVDS (opt.)
  • 1x PCIe x16, 1x PCIe x1, 1x full size Mini PCIe + USB or mSATA, 1x half size Mini PCIe USB, 1x SPI header for external BIOS
  • High Definition Audio with 7.1 channels
  • Vertical onboard USB 2.0 for a security dongle

The AmITX-HL-G is a Mini-ITX embedded board supporting the Desktop 4th Generation Intel® Core™ i7/i5/i3 and Pentium®/Celeron® Processor with Intel® Q87/H81 Chipset. The AmITX-HL-G is specifically designed for customers who need high-level processing and graphics performance with a long product life solution.

  • AMD® Embedded R-Series APU with A77E Fusion Controller Hub
  • Up to 16 GB non-ECC dual channel DDR3L at 1600/1333 MHz
  • 2x LAN, 4x USB 3.0, 9x USB 2.0, 4x COM, 2x Mini-PCIe, mSATA, PCIe x16 (Gen 3) & PCIe x1 (Gen 2)
  • 4 DisplayPort and LVDS (opt.)
  • Vertical onboard USB 3.0 port with spacing for security
  • SPI pin-header and socketed SPI BIOS chip for option
  • 2x PCIe cards in parallel
  • Designed to meet GLI

The AmITX-BE-G is a Mini-ITX motherboard supporting the 2nd Generation AMD R-Series APU (codename: "Bald Eagle) with A77E Fusion Controller Hub. The AmITX-BE-G is specifically designed for gaming, infotainment, and customers who need high-level processing and excellent graphics performance with low power consumption in a long product life solution. The AmITX-BE-G AMD R-Series APU features a Heterogeneous System Architecture (HSA) and non-ECC type DDR3L dual-channel memory at 1600/1333 MHz to provide excellent overall performance.

  • 3rd Gen Intel Core i7/i5/i3, Xeon, Celeron, and Pentium Processor
  • VGA, DVI-D, and HDMI display output
  • PCIe x4 and PCIe Mini Card slot
  • Dual USB 3.0 ports

The ADLINK AmITX-IB-I (formerly IMB-T40H ) is a Mini-ITX embedded board based on the Intel® Xeon® E3-1275/1225, Core™ i7/i5/i3, Pentium®/Celeron®, built on 22/32-nm process technology, using the LGA1155 socket. Combined with the Intel® H61 Express Chipset, the AmITX-IB-I (formerly IMB-T40H), supports Dual Channel DDR3 1333/ 1066 SDRAM up to 16GB, integrated Intel® HD Graphics (VGA, DVI-D, HDMI outputs), dual Gigabit Ethernet, 2x SATA 3 Gb/s ports, 2x USB 3.0 ports, and one USB 2.0 internal vertical type connector.

Arduino form factor

ShieldBuddy - world's smallest AURIX development board

  • The world’s smallest AURIX development board
  • Fitted with the Infineon TC275 32-bit multicore processor on a board following the Arduino™ standard
  • Compatible with many application shields
  • Evaluation licences for a complete set of development tools are available
  • Ideal for getting started on high-end real time embedded industrial or automotive applications

The ShieldBuddy TC275 is currently the world’s smallest AURIX development board. It is fitted with the Infineon TC275 32-bit multicore processor on a board following the Arduino™ standard making it compatible with many of the application shields that are available.

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