Building a safe and secure embedded world

Boards and modules: by processor

Hitex offers a range of embedded modules which cover a variety of different architectures from a selection of suppliers. The selection below will give you a good overview of the broad range available. If you cannot see something that exactly matches your requirements, then please do not hesitate to get in touch as we cannot show every option here.

Please click on the logos below to be taken to the relevant architecture for your requirements.
 

Modules with ARM processors

TQMa7x - with ARM Cortex™-A7

TQMLS102xA - with Layerscape

emCON-RZ/G1E

  • Graphic with full HD support
  • Extended temperature range
  • High-Speed communication via 2x Gigabit Ethernet and 1xPCIe Interface
  • Low power consumption (typ. 2 W)
  • Integrated Cortex M4
  • IEEE 1588 hardware Support
  • Security functions

The Minimodule TQMa7x, based on the i.MX7 from NXP, combines an ARM Dual Cortex-A7 core technology with a variety of interfaces. The integrated graphics controller supports applications with display and touch screen requirements. For various applications such as networking, industrial automation and controls with requirements for fast and secure data processing, there are two CPU variants available. With a Single- / Dual-Core ARM Cortex™-A7 core and a clock rate up to 2 x 1,0 GHz the TQMa7x provides a balanced ratio between high performance and power dissipation.

  • Graphics
  • Extended temperature range
  • High-speed communication: 3x Gigabit Ethernet, 2x PCle & 1x USB 3.0
  • Low power consumption (typ. 3 W)
  • QorIQ Trust Architecture & ARM TrustZone
  • IEEE 1588 support
  • Security functions & QUICC Engine

The Embedded module TQMLS102xA, based on the processor LS102xA from NXP, combines the ARM Core Architecture with the QorIQ high speed communication technology. The integrated graphics controller supports applications with display and touch screen requirements.

  • Matchbox-sized PROFIBUS interface
  • High-retention USB connector ensures reliable USB cable connection
  • Device parameterization via FDT/DTM
  • Integrated with numerous parameterization and asset management systems
  • Quick and easy PROFIBUS connection for applications such as SCADA or MES

High performance PROFIBUS USB interface for a wide variety of tasks from network configuration and device parameterization to plant maintenance and production data acquisition.

TQMa6x - with ARM Cortex™-A9

DIMM-MX6 Quad/Dual (Cortex-A9)

LEC-iMX6

  • Graphics
  • Extended temperature range
  • e-MMC Flash and NOR Flash
  • Low power consumption (typ. 4 W)
  • Long-term availability
  • IEEE 1588 Support
  • Security functions

The Minimodule TQMa6x, based on the processor MCIMX6 from NXP, combines Industry and Multimedia. The integrated graphic controller supports displays with a resolution up to Full HD. Therefore the module is best suited for HMI and animated display screen- and accordingly multitouch applications. With an ARM Cortex™ A9 core and a clock rate up to 4 x 1,2 GHz the TQMa6x provides a balanced ratio between performance and power dissipation.

  • Most powerful SODIMM modules
  • Scalable from 2 x 800 MHz to 4 x 1 GHz
  • Multi-media peripherals  
  • Long-term availability
  • Intended for industrial applications and HMI applications
  • Ready-to-use BSPs: Linux, Windows, QNX, Android

The most powerful members of the SODIMM family, DIMM-MX6Q and DIMM-MX6D with HDMI, can be scaled flexibly from 2*800 MHz up to 4*1 GHz due to the use of different processor versions.

  • Freescale SoC i.MX6 ARM Cortex A9 processor
  • Integrated 2D/3D graphics processors, 3D 1080p video processing
  • Scalable memory: 512 MB to 2 GB
  • Up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s
  • Extended temperature: -40°C to +85°C

The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.

emCON-MX6

TQMa6ULx with ARM Cortex™-A7

TQMa53 with ARM Cortex-A8

  • Scalable: 2 x 800 MHz to 4 x 1 GHz
  • Multi-media peripherals
  • Long-term availability
  • Ideal for industrial applications and HMI applications
  • Ready-to-use BSPs: Linux, Windows, QNX and Android

The powerful members of the emCON family, emCON-MX6Q and emCON-MX6D can be scaled flexibly from 2*800 MHz up to 4*1 GHz due to the use of different processor versions.

  • Graphics
  • Extended temperature range
  • 2x Ethernet with IEE1588
  • Low power consumption (typ. 1 W)
  • Camera sensor interface
  • Security functions
  • Long-term availability

The Minimodule TQMa6ULx, based on the i.MX6UL / i.MX6ULL, combines the ARM Cortex-A7 core technology with a variety of interfaces. The integrated graphics controller supports applications with display and touch screen requirements. For various applications such as, industrial automation and controls with requirements for low power and secure data processing, there are three CPU variants available. With a Single Cortex™-A7 core and a clock rate up to 528 MHz the TQMa6ULx provides a balanced ratio between applications for visualization and control performance and power dissipation.

  • All CPU interfaces are available
  • Graphics
  • Extended temperature range
  • e-MMC-Flash
  • Low power consumption (typ. 3 W)
  • Long-term availability
  • IEEE 1588 support
  • Security functions

The Minimodule TQMa53, based on the processor i.MX537 from NXP, combines Industry and Multimedia. The integrated graphic controller supports displays with a resolution up to UXGA. Therefore the module is best suited for HMI and animated display screen- and accordingly multitouch applications.With an ARM Cortex™ A8 core and a clock rate up to 1,2 GHz the TQMa53 provides a balanced ratio between performance and power dissipation. 

DIMM-MX53 (Cortex™-A8)

TQMa335x with Sitara™ AM335x

TQMa335xL with Sitara™ AM335x

  • Fully scalable
  • 2D/3D graphics
  • Guaranteed long-term availability
  • Intended for industrial applications, operating tasks & HMI applications
  • Ready-to-use BSPs: Linux, Windows, QNX and Android

The SODIMM-modules DIMM-MX535 and DIMM-MX537 can be scaled flexibly due to the use of different processor versions.

  • Real-time communications subsystem
  • Low-cost due to highest level of integration
  • Extended temperature range
  • 2x IEEE1588 Ethernet (L2 Switch)
  • Low power consumption (typ. 2 W)
  • Long-term availability

The TQMa335x Minimodule, based on the AM335x processor, offers a balanced ratio between computing and graphic performance. The basis for this is a ARM® Cortex™-A8 core with up to 1 GHz. The realised memory on the module provides best system support. The module is best suited for visualization and control applications with real time demands.

  • Real-time communications subsystem
  • Recommended for high quantity use
  • Low-cost due to highest level of integration
  • Extended temperature range
  • 2x IEEE1588 Ethernet (L2 Switch)
  • Low power consumption (typ. 2 W)
  • Long-term availability

The TQMa335xL Minimodule is the TQMa335x variant without connector and is directly soldered with the baseboard. The basis for this is a ARM ® Cortex™-A8 core with up to 1 GHz. The LGA module has been developed especially for the use in high volume projects. The realised memory on the module provides best system support. The module is best suited for visualization and control applications with real time demands.

DIMM-RZ/A1H (Cortex™-A9)

DIMM-MX257 (ARM9)

TQMa28 - with ARM9

  • 10 MB memory for high performance with low power
  • Accelerated 2D graphics
  • Guaranteed long-term availability 
  • Intended for industrial, mobile & HMI applications
  • Ready-to-use BSPs: Linux, FreeRTOS, ThreadX, embOS

Its integrated 10 MB memory makes this consumption friendly module of the SODIMM-family unique in its performance class, and this by using low power.

Thanks to the accelerated 2D graphics and emtrion's guarantee of long-term availability, these modules are intended for industrial applications and particularly suitable for mobile and HMI applications.

  • All CPU interfaces are available
  • Extended boot options (USB, SD card)
  • eMMC-Flash
  • Extended temperature range
  • Low power consumption (typ. 2-3 W)
  • Long-term availability
  • IEC 61850 stack

The TQMa35 Minimodule, based on the NXP i.MX35 processor, offers a balanced ratio between computing and graphic performance. The basis for this is a ARM 11 core with up to 532 MHz. With the high level of interface and function integration in the CPU a large number of interfaces and module functions are implemented. This allows the basic board to be developed easily and at low-cost. All the processor’s functional pins are on the module plug-in connector. 

  • Low-cost due to highest levels of integration
  • Compact dimensions
  • Extended temperature range
  • 2x IEEE1588 Ethernet (L2 Switch)
  • Low power consumption (typ. 1 W)
  • Long-term availability
  • Power management
  • IEC 61850 stack

The TQMa28 Minimodule, based on the i.MX28 pro­cessor from NXP, offers a balanced ratio between computing and graphic performance. The basis for this is an ARM926 core with up to 450 MHz. The realised memory on the module provides best system support.

TQMa28L with ARM9

  • Smallest ARM9 module
  • High quantity use
  • 2x IEEE1588 Ethernet (L2 Switch)
  • Extended temperature range
  • Low power consumption (typ. 1 W)
  • Long-term availability
  • Power management
  • Battery charge functionality
  • IEC 61850 stack

The TQMa28L Minimodule, is the TQMa28 variant without connector and is directly soldered with the baseboard.

The BGA module has been developed especially for the use in high volume projects. Due to the high level of integration it is extremely space- and cost-saving. This enables an easy and cost-effective baseboard development.

Modules with Power PC processors

TQMT1042 with QorIQ™ T1

TQMP2020 - with NXP QorIQ™ P2

TQMP1020 with NXP QorIQ™ P1

  • Quad core up to 1400 MHz in 28 nm SOI for the best Performance/Watt ratio
  • High-speed communication via 5x Gigabit Ethernet, 4x PCle and two USB 2.0 High Speed interfaces
  • Dual SATA interfaces for data storage
  • Easy function extensions via PCle, eSPI, I²C and IFC (Local Bus)
  • IEEE 1588 time synchronization in hardware
  • Extremely compact module dimensions
  • Display Interface Unit

The TQMT1042 embedded module embodies the next generation of the well-known TQMP1020/2020 QorIQ™ product family. The QorIQ™ T1 processor family inaugurates new applications in industry and communications. With four e5500 (64-bit) cores and a clock rate of up to 4x 1400 MHz, the TQ modules using QorIQ™ processors provide the best ratio between processing speed and power loss. The 28 nm technology significantly reduces the power consumption compared to a QorIQ™ module of the former generation. 

 

  • Easiest migration of PowerQUICC III on QorIQ™ by approved e500v2 core
  • Single (P2010)- and MultiCores (P2020) of 400 up to 2x 1200 MHz in 45nm SOI for best Performance/Watt ratio
  • High-Speed communication via 3x Gigabit Ethernet, 3x PCIe and one USB 2.0 interface
  • Simple function extension via PCIe, SPI, I²C and flexible local bus

The embedded module TQMP2020 manufactured by TQ is the next generation of the well-known PowerQUICC III module family TQM85xx. The TQMP2020 is based on the P2020 dual core communications processor. The NXP QorIQ™ processor family P1 and P2 opens up the possibility of new applications in industry and communications. With one or two e500 cores and a clock speed ranging from 400 MHz to 2x 1200 MHz, the TQ module with its QorIQ™ processors offers an optimal balance between data processing speed and power dissipation.

  • Easiest migration of PowerQUICC III on QorIQ™ by approved e500v2 core
  • Single (P1011/P1012)- and MultiCores (P1020/P1021) of 400 up to 2x 800 MHz in 45nm SOI for best Performance/Watt ratio
  • High-Speed communication via 3x Gigabit Ethernet, 2x PCIe and one USB 2.0 interface
  • Simple function extension via PCIe, SPI, I²C and flexible local bus

The embedded module TQMP2020 manufactured by TQ is the next generation of the well-known PowerQUICC III module family TQM85xx. The NXP QorIQ™ processor family P1 and P2 opens up the possibility of new applications in industry and communications. With one or two e500 cores and a clock speed ranging from 400 MHz to 2x 1200 MHz, the TQ module with its QorIQ™ processors offers an optimal balance between data processing speed and power dissipation.

TQM5200S with MPC5200

TQM5200 with MPC5200

  • NXP MPC5200 (Power Architecture), 400 MHz
  • Substantial computing power, numerous interfaces
  • Multifunctional external bus (PCI / ATA / IDE)
  • Up to 6 serial interfaces
  • Compact outer dimensions (60mm x 56mm)
  • Low power dissipation, passive cooling
  • Robust 0,8mm mezzanine connection system, long-term availability
  • Temperature sensor

The embedded module with the MPC5200 processor is available in a very tiny size. The small dimensions of the TQM5200S are especially notable (60mm x 56mm compared to 60mm x 80mm) along with the additional temperature sensor on the module. This gives you more space and enhances reliability and monitoring.

  • NXP MPC5200 (Power Architecture), 400 MHz
  • High graphics performance through integrated graphics controller (SM501/SM502)
  • Substantial computing power, numerous interfaces
  • Multifunctional external busses (PCI / ATA / IDE)
  • Compact outer dimensions (80mm x 60mm)
  • Low power dissipation, passive cooling
  • Robust 0,8mm mezzanine connection system, long-term availability

The embedded TQM5200 module is based on the MPC5200 Power Architecture processor by NXP. With 760 MIPS at a clock frequency of 400 MHz, the MPC5200 achieves a performance class that can handle a wide range of applications. It comes with up to six serial interfaces (PSC1 to PSC6). These can be used for numerous different synchronous and asynchronous protocols.

Modules with x86 processors

ETX-BT with Intel® Atom™ Processor

cExpress-BT2 with Intel® Atom™ or Intel® Celeron® Processor SoC

Q7-BW with Intel® Pentium™ and Celeron™ Processor

  • Intel® Atom™ E3800 Series SoC & Celeron N2930/J1900 Processor
  • 4 GB non-ECC DDR3L at 1333 MHz
  • Dual channel 24-bit LVDS & VGA
  • 2x SATA & 2x PATA (M/S), 4x USB 2.0, 10/100 Mbps LAN (GbE via onboard connector)
  • Extreme Rugged operating temperature: -40° to +85°
  • Supports Smart Embedded Management Agent (SEMA)

The ETX-BT is based on the latest Intel® Atom™ processor E3800 SoC series, adopting the latest 22nm process technology with 3-D Tri-Gate transistors featuring significant improvements in computational performance and energy efficiency. The E3800 SOC series integrates processor and GPU cores and all I/O on a single chip. Processor performance is scalable from a single-core Intel® Atom™ processor E3815 at 1.4GHz to a quad-core Intel® Atom™ processor E3845 at 1.9GHz. Two quad-core Intel® Celeron® processors, based on the same microarchitecture, are also available.

  • Single, dual, Quad-core Intel® Atom™ or Celeron® Processor System-on-Chip
  • Up to 8GB Dual Channel DDR3L at 1333MHz
  • VGA and dual channel 18/24-bit LVDS
  • Two PCIe x1, and 32-bit PCI bus
  • GbE, one SATA 3Gb/s, one PATA IDE, seven USB 2.0
  • Supports Smart Embedded Management Agent (SEMA®)

The cExpress-BT2 is a COM Express COM.0 R2.1 Type 2 module supporting Intel Atom processor E3800 Series and Intel Celeron N2930/J1900 processor SoC (codename: Bay Trail). The cExpress-BT2 is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.

  • Intel® Pentium™ & Celeron™ Processor N3000 Series SoC
  • 2x 64bit memory channel with up to 8GB DDR3L at 1600 MHz
  • Dual channel LVDS, HDMI/DP
  • 2x MIPI CSI camera interface, 3x PCIe, GbE
  • 2x SATA3 or 1x SATA and 1x SATA-SSD
  • 1x USB 3.0 host, 6x USB 2.0 host, SPI, I2C, HDA, UART, LPC, SMBus

Qseven is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET. The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor. The Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for PCI Express graphics cards in notebooks.

Q7-BT with 4th Generation Intel® Atom™ Processor

LEC-BW with Intel® Pentium™ and Celeron™ Processor

LEC-BTS with Intel® Atom™ Processor E3800 Series

  • Single, dual or quad core 4th Generation Intel® Atom™ Processor E3800 Series System-on-Chip
  • Up to 4 GB DDR3L at 1066/1333 MHz
  • HDMI 1.4b and dual channel LVDS
  • GbE, MIPI CSI camera interface
  • 2x SATA 3Gb/s or 1x SATA and 1x SATA-SSD
  • Extreme Rugged™ -40°C to +85°C
  • Supports Smart Embedded Management Agent (SEMA)

Qseven is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET. The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor.

  • Dual or quad-core Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
  • Up to 8 GB DDR3L at 1333/1600 MT/s
  • Single channel LVDS, HDMI/DP
  • 2x MIPI CSI camera interfaces, GbE, 3x PCIe
  • 1x SDIO, 2x SATA3, 1x USB 3.0 host, 4x USB 2.0 host, 12x GPIO, 2x SPI, 4x I2C, 1x eMMC

The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. The Modules are used as building blocks for portable and stationary embedded systems.

  • Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip
  • Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)
  • HDMI and LVDS
  • GbE, camera interface
  • 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO
  • Extreme Rugged™ operating temperature: -40°C to +85°C

The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.

LEC-BT with Intel® Atom™ Processor E3800 Series

Express-BD7 with Up to 16 cores Intel® Xeon D and Pentium® D

Express-SL/SLE with 6th Gen Intel Core, Xeon & Celeron Processors

  • Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip
  • Up to 8 GB DDR3L at 1066/1333 MHz (ECC)
  • HDMI and LVDS, onboard eMMC
  • GbE, camera interface
  • 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO
  • Extreme Rugged™ operating temperature: -40°C to 85°C

The ADLINK LEC-BT computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BT is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

  • Up to 16 cores Intel® Xeon D Series SoC
  • Up to 32GB dual channel DDR4 at 1867/2133/2400MHz ECC
  • Two 10G Ethernet and NC-SI support
  • Up to eight PCIe x1 (Gen2), one PCIe x16 (Gen3)
  • GbE, two SATA 6 Gb/s, four USB 3.0/2.0
  • Supports Smart Embedded Management Agent (SEMA®)
  • Extreme Rugged operating temperature: -40°C to +85°C

The Express-BD7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel® Xeon® processor D and Intel® Pentium® D processor system-on-chip (SoC) ( formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.

  • 6th Gen Intel Core, Xeon and Celeron Processor with Intel QM170/HM170/CM236 Chipset (codename: Skylake)
  • Up to 32GB dual channel ECC or non-ECC DDR4 at 2133 MHz
  • 3x DDI channels, 1x LVDS (or 4 lanes eDP), supports up to 3 independent displays
  • 8 PCIe x1 and 1 PCIe x16
  • GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
  • Supports Smart Embedded Management Agent (SEMA)
  • Extreme Rugged operating temperature: -40°C to +85°C

The Express-SL/SLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution. The Express-SL/SLE features Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR4 dual-channel memory at 1866/2133 MHz with ECC/non-ECC support determined by CPU/chipset combination to provide excellent overall performance.

cExpress-SL with 6th Gen Intel Core i7/i5/i3 and Celeron 3955U

TQMx60EB with Intel® Core™ i3/i5/i7 6000E (Generation 6)

Express-BL with 5th Gen Intel Core and Xeon Processors

  • Up to 32GB non-ECC Dual channel DDR4 at 2133/1867 MHz
  • Two DDI channels, one LVDS or 4 lanes eDP, support up to 3 displays
  • Up to 6 PCIe x1
  • GbE, up to 3x SATA 6 Gb/s, 4x USB 3.0 & 4x USB 2.0
  • Supports Smart Embedded Management Agent (SEMA)
  • Extreme Rugged operating temperature: -40°C to +85°C

The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly "Skylake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron™ System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel's Configurable TDP in a long product life solution.

  • High end performance up to Quad-Core 3.7 GHz / 8 MB cache
  • Impressive graphics performance
  • Best in class power optimization
  • Up to 32 GB Dual-Channel DDR4 (2 SO-DIMMs), ECC
  • High bandwidth with up to 24 PCIe Gen. 3 lanes (incl. PCIe x16 PEG port)
  • Highest reliability, 24/7 certified

With Dual-Channel DDR4-2133 support, high bandwidth PCIe, 4x SATA (6 Gb/s) and 4x USB 3.0 the TQMx60EB guarantees best in class system performance. The module can be equipped with 6th Generation Intel® Core™ i7/i5/i3 and Intel® Xeon® E3-15xx v5 processors (Codename Skylake-H). The integrated Intel® GT1/GT2/GT4e graphics controller supports up to three independent display outputs with up to 4K resolution @ 60 Hz and excellent 3D / rendering performance. Latest power and performance optimizing functions like Intel® Turbo Boost Technology 2.0 and Enhanced Intel® SpeedStep Technology enable perfect user experience with moderate power consumption.

  • 5th Gen Intel Core and Xeon Processors (codename: Broadwell)
  • Up to 32GB dual channel DDR3L at 1600 MHz
  • 3x DDI channels, one LVDS and VGA, support up to 3 independent displays
  • Seven PCIe x1 and one PCIe x16
  • GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature:-40°C to +85°C

The Express-BL is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 5th Generation Intel® Core™ i7 and Xeon® E3-1200L v4 processors (codename "Broadwell") with Intel® QM87 Chipset. The Express-BL is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.

Express-BE with AMD® Embedded R-Series APU

Express-HL with 4th Gen Intel Core or Celeron Processors

cExpress-HL with 4th Gen Intel® Core™ i7/i5/i3 Processors

  • AMD® Embedded R-Series APU with A77E Fusion Controller Hub
  • Up to 16GB Dual Channel DDR3L at 1600/1333 MHz
  • Three DDI ports and one LVDS port supporting 4 independent displays
  • Seven PCIe x1, one PCIe x16
  • GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA®) functions

The Express-BE is a COM Express® COM.0 R2.1 Type 6 module supporting AMD R-Series APU (codename : Bald Eagle) with A77E Fusion Controller Hub. The Express-BE is specifically designed for customers who need excellent graphics performance and high-level processing performance with low power consumption in a long product life solution. The Express-BE features AMD Bald Eagle APU supporting Heterogeneous System Architecture (HSA) and non-ECC type DDR3L dual-channel memory at 1333/1600 MHz to provide excellent overall performance.

  • 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset and Celeron Processors (Mobile) with Mobile Intel HM86 Express Chipset
  • Up to 16GB Dual Channel DDR3L SDRAM at 1600MHz
  • Three DDI channels supporting 3 independent displays
  • Seven PCIe x1, one PCIe x16
  • GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA®) functions

The Express-HL is a COM Express® COM.0 R2.1 Type 6 module supporting the 64-bit 4th Generation Intel® Core™ i7/i5/3 or Celeron processor with CPU (formerly codenamed Haswell), memory controller, and graphics processor on the same chip. Based on the latest Mobile Intel® QM87 or HM86 Express chipset, the ExpressHL is specifically designed for customers who need high-level processing and graphics performance in a long product life solution.

  • 4th Generation Intel® Core™ i7/i5/i3 Processor SoC
  • Up to 16 GB DDR3L SDRAM at 1600MHz
  • Two DDI channels, one LVDS supporting 3 independent displays
  • Four PCIe x1 or 1 PCIe x4, Gigabit Ethernet
  • Four SATA 6 Gb/s, two USB 3.0, six USB 2.0
  • Supports Smart Embedded Management Agent (SEMA®) functions

The cExpress-HL is a COM Express® COM.0 R2.1 Type 6 Compact size module supporting the 64-bit 4th Generation Intel® Core™ i7/i5/3 ULT Processors with CPU (codename: Haswell), memory controller, graphics processor and I/O hub on the same chip. Leveraging the benefits provided by the Intel® Core™ i7/i5/3 ULT System-on-Chip, the cExpress-HL is specifically designed for customers who need optimum processing and graphics performance with low power consumption in a long product life solution.

Express-HLE with 4th Gen Intel Core i7/i5/i3 Processor with ECC

Express-IB with 3rd Generation Intel® Core™ i7/i5/i3 Processor

Express-IBR with 3rd Gen Intel Core Processor & QM77 Chipset

  • 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset
  • Dual channel 1600/1333 MHz DDR3L up to 16GB with ECC support in dual SODIMM sockets
  • Three DDI ports support 3 independent displays
  • Seven PCIe x1, one PCIe x16
  • GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA®) functions

The Express-HLE is a COM Express COM.0 R2.1 Type 6 module supporting the 64-bit 4th Generation Intel Core i7/i5/3 processor with CPU (formerly codenamed Haswell), memory controller, and graphics processor on the same chip. Based on the latest Mobile Intel QM87 Express chipset, the Express-HLE is specifically designed for customers who need high-level processing and graphics performance in a long product life solution.

  • Quad/dual core 3rd Generation Intel® Core™ i7/i5/i3 Processor with Mobile Intel® QM77 Express Chipset
  • Up to 16GB Dual Channel DDR3 SDRAM at 1600MHz
  • Three Digital Display Interfaces (DDI) for DisplayPort /HDMI/DVI/SDVO
  • Seven PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1)
  • Two SATA 3 Gb/s, two SATA 6 Gb/s, Gigabit Ethernet, four USB 3.0, four USB 2.0

The Express-IB is a high performance COM.0 R2.0 Type 6 module featuring an Intel® Core™ i7/i5/i3 processor supporting Intel® HD Graphics integrated on the CPU with three independent displays. A PCI Express x16 Generation 3.0 bus is available for discrete graphics expansion or general purpose PCIe (optionally configure as 2 x8 or 1 x8 + 2 x4).

  • Quad/dual core 3rd Generation Intel® Core™ Processor with Mobile Intel® QM77 Express Chipset
  • Up to 16GB 1600MHz DDR3 with ECC support in two SODIMM sockets
  • Three Digital Display Interfaces (DDI) for DisplayPort /HDMI/DVI/SDVO
  • Seven PCIe x1 (Gen 2), one PCIe x16 (Gen 3) for graphics (or general purpose x8/4/1)
  • Two SATA 6 Gb/s, two SATA 3 Gb/s, Gigabit Ethernet, USB 2.0, 4 USB 3.0
  • 50% Thicker PCB for high vibration environments

ADLINK™ Express-IBR is a COM Express® Type 6 module with quad/dual-core 3rd Generation Intel® Core™ i7/i5/i3 Processor. The Express-IBR is designed Extreme Rugged™ to support the extremes of shock, vibration, humidity, and temperature.

Express-HR with 2nd Gen Intel Core i7/i5/i3 & Intel QM67

Express-HRR with Intel® Core™ i7 processor and QM67 Chipset

cExpress-BT with Intel® Atom™ or Intel® Celeron® Processor SoC

  • Intel® AtomTM E3800 ("Bay Trail-I")
  • Up to 8 GB DDR3L with ECC support, soldered
  • Optimized for ultra low power
  • Extended temperature support 
  • Reach featured uEFI BIOS with easy-config, multi-setup and touch-support
  • TQMx86 board-controller with customer specific expandability (flexiCFG)
  • USB 3.0 device interface; TPM 1.2 / 2.0
  • iRTC (highly accurate Industrial Real-Time-Clock)
  • Highest reliability, 24/7 certified
  • Extra robust design; formal coating capability

The TQ mini module TQMxE38C enables the implementation of powerful but also economical x86 based systems based on the international established PICMGTM standard COM ExpressTM Mini (COM.0 R2.1). At the type 6 compliant pin out the user has access to all fundamental interfaces of the CPU. For that all capabilities of the Intel® AtomTM processor could be used. 

  • Quad/dual core Intel® Core™ i7 Processor
  • Intel® QM67 Chipset
  • Up to 16GB ECC 1333Mhz DDR3 memory in two SODIMM sockets
  • Three Digital Display Interfaces (DDI) for DisplayPort /HDMI/DVI/SDVO
  • Seven PCIe x1, one PCIe x16 (Gen2) for graphics (or general purpose x8/4/1)
  • Two SATA 6 Gb/s, two SATA 3 Gb/s, Gigabit Ethernet, eight USB 2.0
  • Extended Temperature: -40°C to +85°C
  • 50% Thicker PCB for high vibration environments

ADLINK™ Express-HRR is a COM Express® Type 6 module with quad/dual-core 2nd Generation Intel® Core™ i7 Processor. The Express-HRR is designed Extreme Rugged to support the extremes of shock, vibration, humidity, and temperature.

  • Single, dual, quad-core Intel® Atom™ or Celeron® Processor System-on-Chip (SOC)
  • Up to 8GB Dual Channel DDR3L at 1333MHz
  • VGA and two DDI channels (optional LVDS)
  • Three PCIe x1, GbE
  • Two SATA 3Gb/s, one USB 3.0, seven USB 2.0
  • Supports Smart Embedded Management Agent (SEMA®) functions

The cExpress-BT is a COM Express® COM.0 R2.1 Type 6 module supporting the Intel® Atom™ processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.

TQMxE38C - with Intel® Atom™ E3800

nanoX-BT with Intel Atom E3800 series SoC or Celeron Processors

TQMxE38M with Intel® Atom™ E3800

  • Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip
  • Up to 8 GB DDR3L at 1066/1333 MHz (ECC)
  • HDMI and LVDS, onboard eMMC
  • GbE, camera interface
  • 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO
  • Extreme Rugged™ operating temperature: -40°C to 85°C

The ADLINK LEC-BT computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BT is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

  • Single, dual, quad-core Intel Atom or Celeron Processor System-on-Chip
  • Up to 4GB soldered Dual Channel DDR3L at 1333MHz
  • One DDI channel, one LVDS (optional eDP)
  • Three PCIe x1, GbE
  • Two SATA 3Gb/s, four USB and one USB client
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40C to +85C (optional)
  • Starter kit for development: nanoX-BT starter kit Plus; Carrier Board: MiniBASE-10R

The nanoX-BT is a COM Express COM.0 R2.1 Type 10 module supporting Intel Atom processor E3800 Series and Intel Celeron N2930/J1900 processor SoC (codename: Bay Trail). The nanoX-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.

  • Intel® AtomTM E3800 ("Bay Trail-I")
  • Up to 8 GB DDR3L with ECC support, soldered
  • Optimized for ultra low power
  • Extended temperature support 
  • Reach featured uEFI BIOS with easy-config, multi-setup and touch-support
  • TQMx86 board-controller with customer specific expandability (flexiCFG)
  • USB 3.0 device interface; TPM 1.2 / 2.0
  • iRTC (highly accurate Industrial Real-Time-Clock)
  • Highest reliability, 24/7 certified
  • Extra robust Design; formal coating capability

The TQ mini module TQMxE38M enables the implementation of powerful but also economical x86 based systems based on the international established PICMGTM standard COM ExpressTM Mini (COM.0 R2.1). At the type 10 compliant pin out the user has access to all fundamental interfaces of the CPU. For that all capabilities of the Intel® AtomTM processor could be used.

nanoX-TC with Intel® Atom™ Processor

nanoX-TCR Extreme Rugged with Intel® Atom™ Processor

Express-HL2 with 4th Gen Intel® Core™ i7/i5/i3 Processor

  • Intel® Atom™ Processor E6xx from 600 MHz up to 1.6 GHz
  • Up to 2 GB soldered DDR2 SDRAM at 800 MHz
  • 24-bit LVDS and SDVO support
  • 4x PCI Express x1 lanes
  • Optional Intel® Platform Controller Hub EG20T for USB, LAN, SDIO, Serial & CAN bus and SATA

No bigger in size than a business card, the nanoX-TC is a COM Express™ Mini form factor Type 10 pinout compatible computer-on-module that targets battery powered, mobile and handheld system designs. The new Mini size form factor with a footprint of just 55 mm x 84 mm is the smallest size in ADLINK's COM Express product lineup, next to the Basic size (125 mm x 95 mm) and Compact size (95x95) form factors.

  • Intel® Atom™ Processor E6xx from 600 MHz up to 1.6 GHz
  • 1-2 GB soldered industrial grade 800MHz DDR2 SDRAM
  • 24-bit LVDS and SDVO support
  • PCI Express x1 lanes
  • Intel® Platform Controller Hub EG20T for USB, LAN, SDIO, Serial & CAN bus and SATA
  • Optional Solid State Drive up to 16 GB
  • COM Express® COM.0 R2.1 Type 10 Pinout

ADLINK™ nanoX-TCR is a COM Express® Nano Type 10 module with the Intel® Atom™ Processor E6xxT. The nanoX-TCR is designed Extreme Rugged™ for wide temperature range and high vibration environments.

  • 4th Gen Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express
  • Up to 16GB Dual Channel DDR3L at 1600MHz
  • Dual Channel LVDS and VGA supporting 2 independent displays
  • Six PCIe x1, one PCIe x16 and 32-bit PCI-bus
  • GbE, four SATA 6 Gb/s, one PATA,IDE, eight USB 2.0
  • Supports Smart Embedded Management Agent (SEMA®)

ADLINK"s Express-HL and Express-HL2 COM Express modules with 4th generation Intel® i7/i5 processor (codename: Haswell) - up to 3.1GHZ quad core - and mobile Intel® QM87 Express chipset offer up to 16GB dual channel DDR3L SDRAM at 1600MHz. The Express-HL is a COM Express Type 6 module offering three independent displays via DDI interface, as well as seven PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1), four SATA III (6 Gb/s), Gigabit Ethernet, four USB 2.0, and four USB 3.0 interfaces. The Express-HL2 features the COM Express Type 2 pinout and offers 18/24-bit single/dual channel LVDS, Analog CRT, and a legacy 32 bit PCI bus, as well as PATA IDE interface.

Express-IBE2 with Intel® Core™ i7/i5/i3 Processor

Express-CB with Intel® Core i7/i5/i3 Processor

Express-CBR Extreme Rugged with Intel® Core™ i7 Processor

  • Quad/dual-core Intel® Core™ i7/i5/i3 Processor with Mobile Intel® QM77 Express Chipset
  • Up to 16GB Dual Channel DDR3 SDRAM at 1600MHz with ECC memory
  • Single/dual channel 18/24-bit LVDS and SDVO
  • Five PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1)
  • Four SATA, one PATA IDE, GbE and eight USB 2.0
  • Supports Smart Embedded Management Agent (SEMA®)

The Module Computing Product Segment (MCPS) is pleased to introduce its latest COM Express® Type 2 Module with Intel® Core™ i7/i5/i3 Processor and QM77 Chipset, the Express-IBE2. The Express-IBE2 is a COM Express® COM.0 R2.1 Type 2 module with a 3rd Generation Intel® Core™ i7/i5/3 processor and support for error-correcting code (ECC) memory.

  • Intel® Core™ i7/i5/i3 Processor with Mobile Intel® QM57 Express Chipset
  • Up to 8 GB Dual Channel DDR3 SDRAM at 1066 MHz (optional ECC)
  • Six PCIe x1, one PCIe x16 for graphics (or general purpose x8/4/1)
  • 18/24-bit LVDS and Embedded DisplayPort
  • SATA 3 Gb/s IDE (PATA), Gigabit LAN, USB 2.0

The Express-CB is a COM Express™ Type 2 module supporting the 64-bit IntelR Core™ i7 / i5 / i3 processor with CPU, memory controller, and graphics processor on the same chip. Based on the latest Mobile IntelR QM57 Express chipset, the Express-CB is specifically designed for customers who need high-level processing and graphics performance in a long product life solution. Integrated graphics support includes features such as OpenGL 2.1, DirectX10, and IntelR Dynamic Video Memory Technology (IntelR DVMT 5.0). Graphics outputs include CRT, LVDS and Embedded DisplayPort. The Express-CB is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

  • Intel® Core™ i7 Processor with Mobile Intel® QM57 Express Chipset
  • Dual Channel DDR3 SODIMM up to 8GB
  • Onboard Gigabit Ethernet
  • Embedded DisplayPort (eDP) or PCI Express x8
  • Dual Channel 18/24-bit LVDS, VGA and SDVO

The Express-CBR leverages the Intel® Core™ i7 processor for ultra high performance and the Intel® 82574IT GbE Controller for a wide range of temperature applications. USB 2.0, SATA and PICMG® COM Express™ COM.0 compliance. Also featured are Intel® Turbo Boost, Hyper-Threading Technology, USB 2.0, SATA and PICMG® COM Express™ COM.0 compliance.

Modules with AURIX processors

ShieldBuddy - world's smallest AURIX development board

  • The world’s smallest AURIX development board
  • Fitted with the Infineon TC275 32-bit multicore processor on a board following the Arduino™ standard
  • Compatible with many application shields
  • Evaluation licences for a complete set of development tools are available
  • Ideal for getting started on high-end real time embedded industrial or automotive applications

The ShieldBuddy TC275 is currently the world’s smallest AURIX development board. It is fitted with the Infineon TC275 32-bit multicore processor on a board following the Arduino™ standard making it compatible with many of the application shields that are available.

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