Embedded Modules by Processor

Hitex offers a range of embedded modules which cover a variety of different architectures from a selectionof suppliers. The selection below will give you a good overview of the broad range available. If you cannot see something that exactly matches your requirements, then please do not hesitate to get in touch as we cannot show every option here.

Please click on the logos below to be taken to the relevant architecture for your requirements.

 

Modules with ARM processors

TQMa7x - with ARM Cortex™-A7

 

  • Graphic with full HD support
  • Extended temperature range
  • High-Speed communication via 2x Gigabit Ethernet and 1xPCIe Interface
  • Low power consumption (typ. 2 W)
  • Integrated Cortex M4
  • IEEE 1588 hardware Support
  • Security functions
     

TQMLS102xA - with Layerscape

 

  • Graphics
  • Extended temperature range
  • High-speed communication: 3x Gigabit Ethernet, 2x PCle & 1x USB 3.0
  • Low power consumption (typ. 3 W)
  • QorIQ Trust Architecture & ARM TrustZone
  • IEEE 1588 support
  • Security functions & QUICC Engine

emCON-RZ/G1E

 

  • 2 high-performance Cortex-A7 cores
  • 2 x Ethernet interfaces (1 x Gigabit) 
  • Multimedia connectivity
  • Long-term availability
  • Ideal for industrial applications 
     
     

TQMa6x - with ARM Cortex™-A9

 

  • Graphics
  • Extended temperature range
  • e-MMC Flash and NOR Flash
  • Low power consumption (typ. 4 W)
  • Long-term availability
  • IEEE 1588 Support
  • Security functions

DIMM-MX6 Quad/Dual (Cortex-A9)

 

  • More Info
  • Get me a quote
  • Download a datasheet

  • Most powerful SODIMM modules
  • Scalable from 2 x 800 MHz to 4 x 1 GHz 
  • Multi-media peripherals  
  • Long-term availability
  • Intended for industrial applications and HMI applications
  • Ready-to-use BSPs: Linux, Windows, QNX, Android
     

LEC-iMX6

 

  • Freescale SoC i.MX6 ARM Cortex A9 processor
  • Integrated 2D/3D graphics processors, 3D 1080p video processing
  • Scalable memory: 512 MB to 2 GB
  • Up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s
  • Extended temperature: -40°C to +85°C

emCON-MX6

 

  • More Info
  • Get me a quote
  • Download a datasheet

  • Scalable: 2 x 800 MHz to 4 x 1 GHz
  • Multi-media peripherals
  • Long-term availability 
  • Ideal for industrial applications and HMI applications 
  • Ready-to-use BSPs: Linux, Windows , QNX and Android

    TQMa6ULx with ARM Cortex™-A7

     

    • Graphics
    • Extended temperature range
    • 2x Ethernet with IEE1588
    • Low power consumption (typ. 1 W)
    • Camera sensor interface
    • Security functions
    • Long-term availability

      TQMa53 with ARM Cortex-A8

       

      • All CPU interfaces are available
      • Graphics
      • Extended temperature range
      • e-MMC-Flash
      • Low power consumption (typ. 3 W)
      • Long-term availability
      • IEEE 1588 support
      • Security functions

      DIMM-MX53 (Cortex™-A8)

       

      • Fully scalable
      • 2D/3D graphics
      • Guaranteed long-term availability
      • Intended for industrial applications, operating tasks & HMI applications
      • Ready-to-use BSPs: Linux, Windows, QNX and Android

      TQMa335x with Sitara™ AM335x

       

      • Real-time communications subsystem
      • Low-cost due to highest level of integration
      • Extended temperature range
      • 2x IEEE1588 Ethernet (L2 Switch)
      • Low power consumption (typ. 2 W)
      • Long-term availability

      TQMa335xL with Sitara™ AM335x

       

      • Real-time communications subsystem
      • Recommended for high quantity use
      • Low-cost due to highest level of integration
      • Extended temperature range
      • 2x IEEE1588 Ethernet (L2 Switch)
      • Low power consumption (typ. 2 W)
      • Long-term availability

      DIMM-RZ/A1H (Cortex™-A9)

        

      • 10 MB memory for high performance with low power
      • Accelerated 2D graphics
      • Guaranteed long-term availability 
      • Intended for industrial, mobile & HMI applications
      • Ready-to-use BSPs: Linux, FreeRTOS, ThreadX, embOS

      DIMM-MX257 (ARM9)

       

      • All CPU interfaces are available
      • Extended boot options (USB, SD card)
      • eMMC-Flash
      • Extended temperature range
      • Low power consumption (typ. 2-3 W)
      • Long-term availability
      • IEC 61850 stack

      TQMa28 - with ARM9

       

      • Low-cost due to highest levels of integration
      • Compact dimensions
      • Extended temperature range
      • 2x IEEE1588 Ethernet (L2 Switch)
      • Low power consumption (typ. 1 W)
      • Long-term availability
      • Power management
      • IEC 61850 stack

      TQMa28L with ARM9

       

      • Smallest ARM9 module
      • High quantity use
      • 2x IEEE1588 Ethernet (L2 Switch)
      • Extended temperature range
      • Low power consumption (typ. 1 W)
      • Long-term availability
      • Power management
      • Battery charge functionality
      • IEC 61850 stack

      Modules with PowerPC Processors

      TQMT1042 with QorIQ™ T1 processor (coming soon)

             

      • Quad core up to 1400 MHz in 28 nm SOI for the best Performance/Watt ratio
      • High-speed communication via 5x Gigabit Ethernet, 4x PCle and two USB 2.0 High Speed interfaces
      • Dual SATA interfaces for data storage
      • Easy function extensions via PCle, eSPI, I²C and IFC (Local Bus)
      • IEEE 1588 time synchronization in hardware
      • Extremely compact module dimensions
      • Display Interface Unit

      TQMP2020 - with NXP QorIQ™ P2

            

      • Easiest migration of PowerQUICC III on QorIQ™ by approved e500v2 core
      • Single (P2010)- and MultiCores (P2020) of 400 up to 2x 1200 MHz in 45nm SOI for best Performance/Watt ratio
      • High-Speed communication via 3x Gigabit Ethernet, 3x PCIe and one USB 2.0 interface
      • Simple function extension via PCIe, SPI, I²C and flexible local bus

      TQMP1020 with NXP QorIQ™ P1

            

      • Easiest migration of PowerQUICC III on QorIQ™ by approved e500v2 core
      • Single (P1011/P1012)- and MultiCores (P1020/P1021) of 400 up to 2x 800 MHz in 45nm SOI for best Performance/Watt ratio
      • High-Speed communication via 3x Gigabit Ethernet, 2x PCIe and one USB 2.0 interface
      • Simple function extension via PCIe, SPI, I²C and flexible local bus

      TQM5200S with MPC5200

      • NXP MPC5200 (Power Architecture), 400 MHz
      • Substantial computing power, numerous interfaces
      • Multifunctional external bus (PCI / ATA / IDE)
      • Up to 6 serial interfaces
      • Compact outer dimensions (60mm x 56mm)
      • Low power dissipation, passive cooling
      • Robust 0,8mm mezzanine connection system, long-term availability
      • Temperature sensor

      TQM5200 with MPC5200

      • NXP MPC5200 (Power Architecture), 400 MHz
      • High graphics performance through integrated graphics controller (SM501/SM502)
      • Substantial computing power, numerous interfaces
      • Multifunctional external busses (PCI / ATA / IDE)
      • Compact outer dimensions (80mm x 60mm)
      • Low power dissipation, passive cooling
      • Robust 0,8mm mezzanine connection system, long-term availability

      Modules with x86 processors

      ETX-BT with Intel® Atom™ Processor

         

      • Intel® Atom™ E3800 Series SoC & Celeron N2930/J1900 Processor
      • 4 GB non-ECC DDR3L at 1333 MHz
      • Dual channel 24-bit LVDS & VGA
      • 2x SATA & 2x PATA (M/S), 4x USB 2.0, 10/100 Mbps LAN (GbE via onboard connector)
      • Extreme Rugged operating temperature: -40° to +85°
      • Supports Smart Embedded Management Agent (SEMA)

      ETX-CV with Dual Core Intel® Atom™ Processor

       

      • Dual core Intel® Atom™ Processor D2550/ N2x00
      • Intel® NM10 Express Chipset
      • Up to 4GB Single Channel DDR3 SDRAM at 1066MHz
      • Dual channel 24-bit LVDS
      • 2x SATA 3x Gb/s, 2x IDE (PATA), LAN, 4 USB 2.0

      Q7-BW with Intel® Pentium™ and Celeron™ Processor

       

      • Intel® Pentium™ & Celeron™ Processor N3000 Series SoC
      • 2x 64bit memory channel with up to 8GB DDR3L at 1600 MHz
      • Dual channel LVDS, HDMI/DP
      • 2x MIPI CSI camera interface, 3x PCIe, GbE
      • 2x SATA3 or 1x SATA and 1x SATA-SSD
      • 1x USB 3.0 host, 6x USB 2.0 host, SPI, I2C, HDA, UART, LPC, SMBus

      Q7-BT with 4th Generation Intel® Atom™ Processor

         

      • Single, dual or quad core 4th Generation Intel® Atom™ Processor E3800 Series System-on-Chip
      • Up to 4 GB DDR3L at 1066/1333 MHz
      • HDMI 1.4b and dual channel LVDS
      • GbE, MIPI CSI camera interface
      • 2x SATA 3Gb/s or 1x SATA and 1x SATA-SSD
      • Extreme Rugged™ -40°C to +85°C
      • Supports Smart Embedded Management Agent (SEMA)

      LEC-BW with Intel® Pentium™ and Celeron™ Processor

       

      • Dual or quad-core Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
      • Up to 8 GB DDR3L at 1333/1600 MT/s
      • Single channel LVDS, HDMI/DP
      • 2x MIPI CSI camera interfaces, GbE, 3x PCIe
      • 1x SDIO, 2x SATA3, 1x USB 3.0 host, 4x USB 2.0 host, 12x GPIO, 2x SPI, 4x I2C, 1x eMMC

      LEC-BTS with Intel® Atom™ Processor E3800 Series

       

      • Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip
      • Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)
      • HDMI and LVDS
      • GbE, camera interface
      • 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO
      • Extreme Rugged™ operating temperature: -40°C to +85°C

      LEC-BT with Intel® Atom™ Processor E3800 Series

         

      • Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip
      • Up to 8 GB DDR3L at 1066/1333 MHz (ECC)
      • HDMI and LVDS, onboard eMMC
      • GbE, camera interface
      • 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO
      • Extreme Rugged™ operating temperature: -40°C to 85°C

      Express-BD7 with Up to 16 cores Intel® Xeon D and Pentium® D

       

      • Up to 16 cores Intel® Xeon D Series SoC
      • Up to 32GB dual channel DDR4 at 1867/2133/2400MHz ECC
      • Two 10G Ethernet and NC-SI support
      • Up to eight PCIe x1 (Gen2), one PCIe x16 (Gen3)
      • GbE, two SATA 6 Gb/s, four USB 3.0/2.0
      • Supports Smart Embedded Management Agent (SEMA®)
      • Extreme Rugged operating temperature: -40°C to +85°C

      Express-SL/SLE with 6th Gen Intel Core, Xeon & Celeron Processors

       

      • 6th Gen Intel Core, Xeon and Celeron Processor with Intel QM170/HM170/CM236 Chipset (codename: Skylake)
      • Up to 32GB dual channel ECC or non-ECC DDR4 at 2133 MHz
      • 3x DDI channels, 1x LVDS (or 4 lanes eDP), supports up to 3 independent displays
      • 8 PCIe x1 and 1 PCIe x16
      • GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
      • Supports Smart Embedded Management Agent (SEMA)
      • Extreme Rugged operating temperature: -40°C to +85°C

      cExpress-SL with 6th Gen Intel Core i7/i5/i3 and Celeron 3955U

        

      • Up to 32GB non-ECC Dual channel DDR4 at 2133/1867 MHz
      • Two DDI channels, one LVDS or 4 lanes eDP, support up to 3 displays
      • Up to 6 PCIe x1
      • GbE, up to 3x SATA 6 Gb/s, 4x USB 3.0 & 4x USB 2.0
      • Supports Smart Embedded Management Agent (SEMA)
      • Extreme Rugged operating temperature: -40°C to +85°C

      TQMx60EB with Intel® Core™ i3/i5/i7 6000E (Generation 6)

       

      • High end performance up to Quad-Core 3.7 GHz / 8 MB cache
      • Impressive graphics performance
      • Best in class power optimization
      • Up to 32 GB Dual-Channel DDR4 (2 SO-DIMMs), ECC
      • High bandwidth with up to 24 PCIe Gen. 3 lanes (incl. PCIe x16 PEG port)
      • Highest reliability, 24/7 certified

      Express-BL with 5th Gen Intel Core and Xeon Processors

       

      • 5th Gen Intel Core and Xeon Processors (codename: Broadwell)
      • Up to 32GB dual channel DDR3L at 1600 MHz
      • 3x DDI channels, one LVDS and VGA, support up to 3 independent displays
      • Seven PCIe x1 and one PCIe x16
      • GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
      • Supports Smart Embedded Management Agent (SEMA) functions
      • Extreme Rugged operating temperature:-40°C to +85°C

      cExpress-BL with 5th Gen Intel Core i7/i5/i3 Processors

         

      • 5th Generation Intel® Core™ i7/i5/i3 and Celeron Processor System-on-Chip
      • Up to 32GB Dual Channel DDR3L at 1600/1333 MHz
      • Two DDI channels, one LVDS supporting 3 independent displays
      • Dual channel 18/24-bit LVDS (or optional eDP)
      • Four PCIe x1 or 1 PCIe x4
      • GbE, four SATA 6 Gb/s, two USB 3.0, six USB 2.0
      • Supports Smart Embedded Management Agent (SEMA®) functions
      • Extreme Rugged operating temperature: -40°C to +85°C

      TQMx50UC with 5th Generation Intel® Core™ i3/i5/i7

       

      • Intel® Core™ 5000U series („Broadwell-U") with up to 3.2 GHz / 4 MB Cache
      • Up to 16 GB DDR3L on board memory
      • Best Performance-per-Watt ratio (15W TDP)
      • Reach featured uEFI BIOS with easy-config, multi- setup and touch support
      • TQMx86 board controller with flexible customization options
      • TPM 1.2 / 2.0
      • iRTC (highly accurate industrial real time clock)
      • Highest reliability, 24/7 certified
      • Rugged design / Conformal coating capability

      cExpress-BW with with Intel Pentium, Celeron N3000 & Atom x5

        

      • Up to 8 GB dual channel DDR3L at 1600 MHz
      • 3x DDI, 1x eDP (optional LVDS in place of eDP), and supporting 3 independent displays
      • GbE, three PCIe x1 (opt. five PCIe x1 with bridge)
      • 2x SATA 6Gb/s (SATA0, SATA1), optional onboard SSD (8/16/32GB) in place of SATA1 port
      • 4x USB 3.0 and 8x USB 2.0
      • Smart Embedded Management Agent (SEMA®) functions

      Express-BE with AMD® Embedded R-Series APU

          

      • AMD® Embedded R-Series APU with A77E Fusion Controller Hub
      • Up to 16GB Dual Channel DDR3L at 1600/1333 MHz
      • Three DDI ports and one LVDS port supporting 4 independent displays
      • Seven PCIe x1, one PCIe x16
      • GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0
      • Supports Smart Embedded Management Agent (SEMA®) functions

      Express-HL with 4th Gen Intel Core or Celeron Processors

         

      • 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset and Celeron Processors (Mobile) with Mobile Intel HM86 Express Chipset
      • Up to 16GB Dual Channel DDR3L SDRAM at 1600MHz
      • Three DDI channels supporting 3 independent displays
      • Seven PCIe x1, one PCIe x16
      • GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0
      • Supports Smart Embedded Management Agent (SEMA®) functions

      cExpress-HL with 4th Gen Intel® Core™ i7/i5/i3 Processors

          

      • 4th Generation Intel® Core™ i7/i5/i3 Processor SoC
      • Up to 16 GB DDR3L SDRAM at 1600MHz
      • Two DDI channels, one LVDS supporting 3 independent displays
      • Four PCIe x1 or 1 PCIe x4, Gigabit Ethernet
      • Four SATA 6 Gb/s, two USB 3.0, six USB 2.0
      • Supports Smart Embedded Management Agent (SEMA®) functions

      Express-HLE with 4th Gen Intel Core i7/i5/i3 Processor with ECC

            

      • 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset
      • Dual channel 1600/1333 MHz DDR3L up to 16GB with ECC support in dual SODIMM sockets
      • Three DDI ports support 3 independent displays
      • Seven PCIe x1, one PCIe x16
      • GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0
      • Supports Smart Embedded Management Agent (SEMA®) functions

      Express-IB with 3rd Generation Intel® Core™ i7/i5/i3 Processor

           

      • Quad/dual core 3rd Generation Intel® Core™ i7/i5/i3 Processor with Mobile Intel® QM77 Express Chipset
      • Up to 16GB Dual Channel DDR3 SDRAM at 1600MHz
      • Three Digital Display Interfaces (DDI) for DisplayPort /HDMI/DVI/SDVO
      • Seven PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1)
      • Two SATA 3 Gb/s, two SATA 6 Gb/s, Gigabit Ethernet, four USB 3.0, four USB 2.0

      Express-IBR with 3rd Gen Intel Core Processor & QM77 Chipset

           

      • Quad/dual core 3rd Generation Intel® Core™ Processor with Mobile Intel® QM77 Express Chipset
      • Up to 16GB 1600MHz DDR3 with ECC support in two SODIMM sockets
      • Three Digital Display Interfaces (DDI) for DisplayPort /HDMI/DVI/SDVO
      • Seven PCIe x1 (Gen 2), one PCIe x16 (Gen 3) for graphics (or general purpose x8/4/1)
      • Two SATA 6 Gb/s, two SATA 3 Gb/s, Gigabit Ethernet, USB 2.0, 4 USB 3.0
      • 50% Thicker PCB for high vibration environments

      Express-HR with 2nd Gen Intel Core i7/i5/i3 & Intel QM67

             

      • Second Generation Intel Quad or Dual Core i7/i5/i3 Processor
      • Intel® QM67 Chipset
      • Up to 16GB Dual Channel DDR3 SDRAM at 1333MHz
      • Three Digital Display Interfaces (DDI) for DisplayPort /HDMI/DVI/SDVO
      • Seven PCIe x1, one PCIe x16 (Gen2) for graphics (or general purpose x8/4/1)
      • Two SATA 3 Gb/s, two SATA 6 Gb/s, Gigabit LAN, eight USB 2.0

      Express-HRR with Intel® Core™ i7 processor and QM67 Chipset

            

      • Quad/dual core Intel® Core™ i7 Processor
      • Intel® QM67 Chipset
      • Up to 16GB ECC 1333Mhz DDR3 memory in two SODIMM sockets
      • Three Digital Display Interfaces (DDI) for DisplayPort /HDMI/DVI/SDVO
      • Seven PCIe x1, one PCIe x16 (Gen2) for graphics (or general purpose x8/4/1)
      • Two SATA 6 Gb/s, two SATA 3 Gb/s, Gigabit Ethernet, eight USB 2.0
      • Extended Temperature: -40°C to +85°C
      • 50% Thicker PCB for high vibration environments

      cExpress-BT with Intel® Atom™ or Intel® Celeron® Processor SoC

            

      • Single, dual, quad-core Intel® Atom™ or Celeron® Processor System-on-Chip (SOC)
      • Up to 8GB Dual Channel DDR3L at 1333MHz
      • VGA and two DDI channels (optional LVDS)
      • Three PCIe x1, GbE
      • Two SATA 3Gb/s, one USB 3.0, seven USB 2.0
      • Supports Smart Embedded Management Agent (SEMA®) functions

      TQMxE38C - with Intel® Atom™ E3800

             

      • Intel® AtomTM E3800 ("Bay Trail-I")
      • Up to 8 GB DDR3L with ECC support, soldered
      • Optimized for ultra low power
      • Extended temperature support 
      • Reach featured uEFI BIOS with easy-config, multi-setup and touch-support
      • TQMx86 board-controller with customer specific expandability (flexiCFG)
      • USB 3.0 device interface; TPM 1.2 / 2.0
      • iRTC (highly accurate Industrial Real-Time-Clock)
      • Highest reliability, 24/7 certified
      • Extra robust design; formal coating capability

      nanoX-BT with Intel Atom E3800 series SoC or Celeron Processors

            

      • Single, dual, quad-core Intel Atom or Celeron Processor System-on-Chip
      • Up to 4GB soldered Dual Channel DDR3L at 1333MHz
      • One DDI channel, one LVDS (optional eDP)
      • Three PCIe x1, GbE
      • Two SATA 3Gb/s, four USB and one USB client
      • Supports Smart Embedded Management Agent (SEMA) functions
      • Extreme Rugged operating temperature: -40C to +85C (optional)
      • Starter kit for development: nanoX-BT starter kit Plus; Carrier Board: MiniBASE-10R

      TQMxE38M with Intel® Atom™ E3800

            

      • ntel® AtomTM E3800 ("Bay Trail-I")
      • Up to 8 GB DDR3L with ECC support, soldered
      • Optimized for ultra low power
      • Extended temperature support 
      • Reach featured uEFI BIOS with easy-config, multi-setup and touch-support
      • TQMx86 board-controller with customer specific expandability (flexiCFG)
      • USB 3.0 device interface; TPM 1.2 / 2.0
      • iRTC (highly accurate Industrial Real-Time-Clock)
      • Highest reliability, 24/7 certified
      • Extra robust Design; formal coating capability

      nanoX-TC with Intel® Atom™ Processor

             

      • Intel® Atom™ Processor E6xx from 600 MHz up to 1.6 GHz
      • Up to 2 GB soldered DDR2 SDRAM at 800 MHz
      • 24-bit LVDS and SDVO support
      • 4x PCI Express x1 lanes
      • Optional Intel® Platform Controller Hub EG20T for USB, LAN, SDIO, Serial & CAN bus and SATA

      nanoX-TCR Extreme Rugged with Intel® Atom™ Processor

            

      • Intel® Atom™ Processor E6xx from 600 MHz up to 1.6 GHz
      • 1-2 GB soldered industrial grade 800MHz DDR2 SDRAM
      • 24-bit LVDS and SDVO support
      • PCI Express x1 lanes
      • Intel® Platform Controller Hub EG20T for USB, LAN, SDIO, Serial & CAN bus and SATA
      • Optional Solid State Drive up to 16 GB
      • COM Express® COM.0 R2.1 Type 10 Pinout

      Express-HL2 with 4th Gen Intel® Core™ i7/i5/i3 Processor

            

      • 4th Gen Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express
      • Up to 16GB Dual Channel DDR3L at 1600MHz
      • Dual Channel LVDS and VGA supporting 2 independent displays
      • Six PCIe x1, one PCIe x16 and 32-bit PCI-bus
      • GbE, four SATA 6 Gb/s, one PATA,IDE, eight USB 2.0
      • Supports Smart Embedded Management Agent (SEMA®)

      Express-IBE2 with Intel® Core™ i7/i5/i3 Processor

             

      • Quad/dual-core Intel® Core™ i7/i5/i3 Processor with Mobile Intel® QM77 Express Chipset
      • Up to 16GB Dual Channel DDR3 SDRAM at 1600MHz with ECC memory
      • Single/dual channel 18/24-bit LVDS and SDVO
      • Five PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1)
      • Four SATA, one PATA IDE, GbE and eight USB 2.0
      • Supports Smart Embedded Management Agent (SEMA®)

      Express-CB with Intel® Core i7/i5/i3 Processor

            

      • Intel® Core™ i7/i5/i3 Processor with Mobile Intel® QM57 Express Chipset
      • Up to 8 GB Dual Channel DDR3 SDRAM at 1066 MHz (optional ECC)
      • Six PCIe x1, one PCIe x16 for graphics (or general purpose x8/4/1)
      • 18/24-bit LVDS and Embedded DisplayPort
      • SATA 3 Gb/s IDE (PATA), Gigabit LAN, USB 2.0

      Express-CBR Extreme Rugged with Intel® Core™ i7 Processor

            

      • Intel® Core™ i7 Processor with Mobile Intel® QM57 Express Chipset
      • Dual Channel DDR3 SODIMM up to 8GB
      • Onboard Gigabit Ethernet
      • Embedded DisplayPort (eDP) or PCI Express x8
      • Dual Channel 18/24-bit LVDS, VGA and SDVO

      cExpress-BT2 with Intel® Atom™ or Intel® Celeron® Processor SoC

             

      • Single, dual, Quad-core Intel® Atom™ or Celeron® Processor System-on-Chip
      • Up to 8GB Dual Channel DDR3L at 1333MHz
      • VGA and dual channel 18/24-bit LVDS
      • Two PCIe x1, and 32-bit PCI bus
      • GbE, one SATA 3Gb/s, one PATA IDE, seven USB 2.0
      • Supports Smart Embedded Management Agent (SEMA®)

      Express-CVC with Intel® Atom™ Processor

            

      • Dual-core Intel® Atom™ Processor with Intel NM10 Express Chipset
      • Up to 4 GB DDR3 SDRAM at 800/1066 MHz
      • Three free PCIe x1 lanes
      • VGA and Single/Dual Channel 18/24-bit LVDS
      • SATA 3 Gb/s, IDE (PATA), GbE, USB 2.0
      • Supports Smart Embedded Management Agent (SEMA®)

      Modules with AURIX Processors

      ShieldBuddy - world's smallest AURIX development board

            

      • The world’s smallest AURIX development board
      • Fitted with the Infineon TC275 32-bit multicore processor on a board following the Arduino™ standard
      • Compatible with many application shields
      • Evaluation licences for a complete set of development tools are available
      • Ideal for getting started on high-end real time embedded industrial or automotive applications