High processing power, low power consumption, pin-compatible with i.MX 6UL/ULL and STM32MP13x SOMs for scalable applications.
The phyCORE-i.MX 91/93 can be equipped with both the i.MX 91 and the i.MX 93 from the i.MX 9x family from NXP. Thanks to the innovative Energy Flex architecture from NXP, the module with both processors offers high computing power with low energy consumption. The integrated EdgeLock® Secure Enclave allows security features such as lifecycle management, tamper detection, secure booting and a simplified path to certifications. Measuring only 36 mm x 36 mm, the module enables the development of powerful, cost-effective and energy-efficient applications.
The SoM is fully pin-compatible with the bestseller phyCORE-i.MX 6UL/ULL and the new phyCORE-STM32MP13x. On the one hand, this offers the possibility of using the phyCORE-i.MX 91/93 as a successor to the i.MX 6UL/ULL in order to extend the service life of the entire product or to upgrade it to higher computing power and additional features such as machine learning. On the other hand, the pin compatibility to the new phyCORE-STM32MP13x allows for new projects to choose one of the platforms after evaluating the performance requirements. It is even possible to develop different end product variants with different performance classes and features, ie applications that are scalable in terms of price/performance ratio, for example. Thus, the new phyCORE-i.MX 93/91 offers upgrade paths, scalable computing power and access to the latest technologies, while at the same time ensuring and improving the longevity of products and applications.
The fully industrial grade phyCORE-i.MX 91/93 is characterized by its price-optimized bill of material. Thanks to Direct Solder Connect technology, the module is suitable for large-scale production and the manufacturing costs of the end application are significantly reduced.
